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Circuit
Security
Thick film hybrid microelectronic components are
amongst the most secure electronics available today, see below to find out why.
Reverse Engineering Protection
The manufacturing technology of Thick Film Hybrid Circuits on
Ceramic, Titanium or Stainless Steel is a cost competitive technology that offers the following
significant advantages for your application:
- Higher reliability compared with a standard Printed Circuit
Board (PCB) resulting from the inherent characteristics of the materials
technology and the use of fewer solder joints;
- The ability to print resistors under other components
results in a smaller size module compared with a PCB where all components
are placed next to each other;
- Overall electronics packaging cost are considerably lower
because the hybrid unit can be encapsulated and then clipped or screwed into
place rather than requiring a separate mounting box;
- The hybrid unit would be fully tested (and burnt in if
required) to ensure operating specifications are met;
- High protection against reverse engineering as detailed
below
Requirements for good reverse engineering
protection are as follows:
1. The technology must be as little known as possible:
- Hybrid technology is not widely known or understood other
than in technologically sophisticated economies. Stainless steel hybrid’s are a relatively new technology,
accordingly they are produced by less than 2% of existing hybrid companies.
This makes it a very secure technology.
- Hybrid Electronics uses a specific materials technology for
thermistors that is unique in its stability with time. This materials
technology would not be economic to re-develop.
2. Encapsulation must be difficult to remove and cause damage
when it is removed:
- Hybrid Electronics have a number of processes available to
achieve this and will work with our customer to ensure the most
security and highest reliability is achieved. These processes include powder
coating, potting and overmoulding.
3. Pricing of the unit should be low enough to discourage
companies from investing the large sums required for reverse engineering:
- Hybrid Electronics are competitive on a worldwide basis and
this minimizes the risk of others finding the technology attractive to copy.
4. Software in the unit must be difficult to read from the
processor:
- There is a compromise between convenience of testing and
calibration (if required) and secrecy of software. Hybrid Electronics has
more than 35 years experience in ensuring an appropriate balance is
achieved.
5. Final Packaging should be ‘smart’ so that the end product
needs the very small size and the convenient packaging offered by the
technology:
- The greatest danger is a PCB functional copy. The risk of
this is minimized by a conveniently packaged hybrid on the final
product.
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